All Categorys

Silicon Products Grinding Wheels

Ruizuan have rich experience on providing solutions for semiconductor industry from silicon ingot cutting, slicing to final wafer product, we can provide:

* Diamond cutting blade for ingot

* Cylindrical grinding wheel for ingot

* Double disc grinding wheel for lapping wafer

* Metal diamond edge grinding wheel for chamfering wafer dge

* Polishing pad and polishing fluid for CMP polishing

* Back grinding wheel for wafer thinning

* Diamond hub-less /hub dicing blade

Description

+86-371-55909782

[email protected]

Description

Description:

We designed series of diiamond grinding wheels for semi-condutor industries & Photovoltaic Industry. They include Thinner Grinding Wheels, Dicing Blades, Precision Cutting Wheels and diamond wires. The workpieces are silicon wafers, monocrystalline silicon, Package Singulation, synthetic sapphiers, Alumina ceramics、EMC、PCB. The processing methods are back thinning, rough & fine grinding, edge grinding, dicing, and precision cuttting. Our diamond wheels are performing well on wear resistance, quality consistency and economically cost-effective.

Semiconductor Thinner Grinding Wheel

Back grinding wheels are mainly used for the thinning andfine grinding of the silicon wafer. These products producedby our institute which possess superior grinding performanceand high cost.

performance are among the top level worldwide. They canbe used with the Japanese, German, American, Korean andChinese grinders.

Model	Dmm)	T (mm)	H (mm)
6A2/6A2H	175	30, 35	76
	200	35	76
	350	45	127
6A2T	195	22.5, 25	170
6A2T	280	30	228.6
6A2T(three ellipses)	350	35	235
6A2T(three ellipses)	209	22.5	158
Other specifications can be produced according to customers’ requirement.

Wafer Dicing Blades

With electro plated nickel bond，ultrathin hub blades can provide stable dicing performance of narrow street wafers.

Exposure(μm)	380	510	640	760	890	1020	1150	1270	Grit Size
Kerf width(μm)	380-510	510-640	640-760	760-890	890-1020	1020-1150	1150-1270	1270-1400	#5000 #4800 #4500 #4000 #3500 #3000 #2500 #2000 #1800 #1700 #1500
16-20	20*380	20*510
21-25	25*380	25*510	25*640
26-30	30*380	30*510	30*640	30*760	30*890	20*1020
31-35	35*380	35*510	35*640	35*760	35*890	35*1020
36-40	40*380	40*510	40*640	40*760	40*890	40*1020	40*1150
41-50	50*380	50*510	50*640	50*760	50*890	50*1020	50*1150
51-60		60*510	60*640	60*760	60*890	60*1020	60*1150	60*1270
61-70			70*640	70*760	70*890	70*1020	70*1150	70*1270
71-80					80*890	80*1020	80*1150	80*1270
81-90						90*1020	90*1150	90*1270
Special size can be designed according to customers’ requirement

Diamond cutting grinding wheel

Diamond cutting grinding wheel: mainly used for ceramics, crystal, quartz, gemstones, carbide,Grooving and cutting of hard and brittle materials such as magnetic materials, electro-optical glass tubes, and optical glass.

D (mm)	T	Grit	bonded	Groove
50 – 250	3 – 20	325 – 3000#	Metal / resin	1-10G
Other size can be designed according to customers’ requirement

Diamond Wires

RZ Diamond wires uses nickel electroplating to coat diamond particles on the surface of ultra-fine steel wires,mainly used for crystal silicon cutting.

We use high strength steel wire as Mother Wire, adopt entire process quality control and automatic electroplating technology. It keeps good distribution of diamond grits, consistency of diamond layer and strong grit holding ability.