Unveils Advanced Grinding Solutions for Semiconductor Silicon Wafer Industry

Meeting the Precision Demands of Semiconductor Silicon Wafer Manufacturing​
In the fast - paced world of semiconductor manufacturing, silicon wafers serve as the fundamental building blocks for a wide range of electronic devices. The process of manufacturing these wafers requires an unprecedented level of precision, and at Zhengzhou Ruizuan Diamond Tools, we are proud to introduce our cutting - edge grinding wheel products that are set to revolutionize the industry.
Our Product Portfolio for Semiconductor Silicon Wafer Grinding​
Semiconductor Thinner Grinding Wheel​
Designed for the critical task of thinning semiconductor wafers, our Semiconductor Thinner Grinding Wheel is engineered with a special resin bond and ultra - fine diamond abrasives. This combination allows for precise material removal while maintaining a high level of surface quality. With a focus on minimizing Total Thickness Variation (TTV), our thinner grinding wheels can achieve TTV values of less than 1μm, ensuring the highest standards of wafer uniformity.​

LED Substrate Metal Back Grinding Wheel​
For the LED substrate manufacturing process, our Metal Back Grinding Wheel is tailored to handle the specific requirements of grinding metal - backed substrates. The metal bond used in these wheels provides excellent durability and high material removal rates. This is crucial for efficiently processing large - volume LED substrates, reducing production time without sacrificing quality. Our wheels can achieve a surface roughness of Ra < 0.5μm, which is essential for ensuring proper adhesion of subsequent layers in LED manufacturing.​

Metal bond Edge Grinding Wheel​
Edge grinding is a vital step in semiconductor wafer production to ensure proper handling and prevent edge chipping. Our Metal bond Edge Grinding Wheel features a single - layer electroplated diamond design. This design allows for precise control of the edge profile, with the ability to achieve chamfer angles as small as ±10μm. The high - strength metal bond ensures long - lasting performance, even when grinding hard silicon wafers.​

Diamond Dicing Blade and Ultra - thin Diamond Dicing Blades​
When it comes to singulating semiconductor wafers into individual chips, our Diamond Dicing Blades and Ultra - thin Diamond Dicing Blades are the go - to solutions. The diamond dicing blades are available in a range of grit sizes, from coarse for rapid material removal to fine for achieving smooth cut edges. Our ultra - thin diamond dicing blades, with thicknesses as low as 0.1mm, are designed to minimize kerf loss, increasing the yield of valuable semiconductor chips. These blades can achieve a total width of effect (TWE) of less than 20μm, ensuring clean and precise cuts.

Technical Innovations and Quality Assurance​
At Ruizuan, we are committed to continuous innovation. All our products are developed in our state - of - the - art R & D facility and are manufactured in an ISO 9001:2015 - certified production environment. We use advanced manufacturing techniques, such as precision electroplating and high - pressure sintering, to ensure the highest quality of our grinding wheels and dicing blades. Each product undergoes rigorous quality control tests, including hardness testing, balance testing, and cutting performance evaluation, to guarantee consistent performance and reliability.